Bumpless Build Cube 3D

Figure 1. Structural diagram of BBCube 3D The proposed technology uses a stacked design where processing units (xPU) sit atop multiple interconnected memory layers (DRAM). By replacing wires with through-silicon vias (TSVs), the lengths of the connections can be shortened, leading to better overall electrical performance.
Three-dimensional integration of processing units and memory for much faster computing